Intel’s packaging doesn’t seem to be that far behind TSMC’s, just with different strengths and weaknesses, at least on the foundry side. On the design side they were slow to actually implement chiplet based design in the actual chips, compared to AMD who embraced it full force early on, and Apple who rely almost exclusively on System-in-a-Package designs (including their “ultra” line of M-series chips that are two massive Max chips stitched together) where memory and storage are all in one package.
Packaging/interconnect tech is starting to be a big factor though, and TSMC is very strong in this area, no? They can lean on that.
Also its weird to even imagine Intel with big external customers…
Intel’s packaging doesn’t seem to be that far behind TSMC’s, just with different strengths and weaknesses, at least on the foundry side. On the design side they were slow to actually implement chiplet based design in the actual chips, compared to AMD who embraced it full force early on, and Apple who rely almost exclusively on System-in-a-Package designs (including their “ultra” line of M-series chips that are two massive Max chips stitched together) where memory and storage are all in one package.